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Advances in Graphic Communication, Printing and Packaging (Repost)

Posted By: AvaxGenius
Date: 12 Apr 2024 05:08:42
Advances in Graphic Communication, Printing and Packaging (Repost)

Advances in Graphic Communication, Printing and Packaging: Proceedings of 2018 9th China Academic Conference on Printing by Pengfei Zhao
English | EPUB | 2019 | 1030 Pages | ISBN : 9811336628 | 143.8 MB

This book includes a selection of reviewed papers presented at the 9th China Academic Conference on Printing and Packaging, which was held in November 2018 in Shandong, China. The conference was jointly organized by the China Academy of Printing Technology and Qilu University of Technology (Shandong Academy of Sciences). With 8 keynote talks and over 200 presented papers on graphic communication and packaging technologies, the conference attracted more than 300 scientists.
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Biobased Packaging Materials

Posted By: hill0
Date: 5 Jan 2024 06:53:25
Biobased Packaging Materials

Biobased Packaging Materials: Sustainable Alternative to Conventional Packaging Materials
English | 2023 | ISBN: 9819960495 | 547 Pages | PDF EPUB (True) | 24 MB
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Chiplet Design and Heterogeneous Integration Packaging (Repost)

Posted By: AvaxGenius
Date: 19 Dec 2023 06:02:41
Chiplet Design and Heterogeneous Integration Packaging (Repost)

Chiplet Design and Heterogeneous Integration Packaging by John H. Lau
English | EPUB (True) | 2023 | 542 Pages | ISBN : 9811999163 | 316.3 MB

The book focuses on the design, materials, process, fabrication, and reliability of chiplet design and heterogeneous integraton packaging. Both principles and engineering practice have been addressed, with more weight placed on engineering practice. This is achieved by providing in-depth study on a number of major topics such as chip partitioning, chip splitting, multiple system and heterogeneous integration with TSV-interposers, multiple system and heterogeneous integration with TSV-less interposers, chiplets lateral communication, system-in-package, fan-out wafer/panel-level packaging, and various Cu-Cu hybrid bonding. The book can benefit researchers, engineers, and graduate students in fields of electrical engineering, mechanical engineering, materials sciences, and industry engineering, etc.
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3D Microelectronic Packaging: From Architectures to Applications (Repost)

Posted By: AvaxGenius
Date: 16 Dec 2023 03:09:20
3D Microelectronic Packaging: From Architectures to Applications (Repost)

3D Microelectronic Packaging: From Architectures to Applications by Yan Li
English | EPUB | 2021 | 629 Pages | ISBN : 9811570892 | 214.5 MB

This book offers a comprehensive reference guide for graduate students and professionals in both academia and industry, covering the fundamentals, architecture, processing details, and applications of 3D microelectronic packaging.
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Nanocellulose-Reinforced Thermoplastic Starch Composites: Sustainable Materials for Packaging

Posted By: arundhati
Date: 20 Nov 2023 01:28:05
Nanocellulose-Reinforced Thermoplastic Starch Composites: Sustainable Materials for Packaging

Salit Mohd Sapuan, "Nanocellulose-Reinforced Thermoplastic Starch Composites: Sustainable Materials for Packaging"
English | ISBN: 3110773562 | 2023 | 464 pages | EPUB | 25 MB
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Food Packaging: Innovations and Shelf-Life

Posted By: Jeembo
Date: 28 Oct 2023 14:48:54
Food Packaging: Innovations and Shelf-Life

Food Packaging: Innovations and Shelf-Life by Rui M. S. da Cruz
English | 2019 | ISBN: 0367085747 | 288 Pages | PDF | 14.7 MB

Food Packaging: Innovations and Shelf-life covers recently investigated developments in food packaging and their influence in food quality preservation, shelf-life extension, and simulation techniques.
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Materials for High-Density Electronic Packaging and Interconnection

Posted By: Jeembo
Date: 20 Oct 2023 16:48:22
Materials for High-Density Electronic Packaging and Interconnection

Materials for High-Density Electronic Packaging and Interconnection
English | 1990 | ISBN: 030904233X | 156 Pages | PDF | 6.4 MB

Electronic packaging and interconnections are the elements that today limit the ultimate performance of advanced electronic systems.
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Nanocellulose-Reinforced Thermoplastic Starch Composites: Sustainable Materials for Packaging

Posted By: roxul
Date: 13 Oct 2023 05:04:41
Nanocellulose-Reinforced Thermoplastic Starch Composites: Sustainable Materials for Packaging

Salit Mohd Sapuan, "Nanocellulose-Reinforced Thermoplastic Starch Composites: Sustainable Materials for Packaging"
English | ISBN: 3110773562 | 2023 | 464 pages | PDF | 10 MB
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Advances in Graphic Communication, Printing and Packaging (Repost)

Posted By: AvaxGenius
Date: 31 May 2023 00:15:02
Advances in Graphic Communication, Printing and Packaging (Repost)

Advances in Graphic Communication, Printing and Packaging: Proceedings of 2018 9th China Academic Conference on Printing by Pengfei Zhao
English | EPUB | 2019 | 1030 Pages | ISBN : 9811336628 | 143.8 MB

This book includes a selection of reviewed papers presented at the 9th China Academic Conference on Printing and Packaging, which was held in November 2018 in Shandong, China. The conference was jointly organized by the China Academy of Printing Technology and Qilu University of Technology (Shandong Academy of Sciences). With 8 keynote talks and over 200 presented papers on graphic communication and packaging technologies, the conference attracted more than 300 scientists.
The proceedings cover the recent findings in color science and technology, image processing technology, digital media technology, mechanical engineering and numerical control, materials and detection, digital process management technology in printing and packaging, and other technologies. As such, the book is of interest to university researchers, R&D engineers and graduate students in the field of graphic arts, packaging, color science, image science, material science, computer science, digital media, and network technology.
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3D IC Integration and Packaging

Posted By: arundhati
Date: 23 Apr 2023 00:28:52
3D IC Integration and Packaging

John Lau, "3D IC Integration and Packaging "
English | ISBN: 0071848061 | 2015 | 480 pages | PDF | 170 MB
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Food Packaging: The Smarter Way

Posted By: hill0
Date: 30 Jan 2023 08:58:46
Food Packaging: The Smarter Way

Food Packaging: The Smarter Way
English | 2022 | ISBN: 9811671958 | 492 Pages | PDF EPUB (True) | 26 MB
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Packaging and the Environment: Alternatives, Trends and Solutions

Posted By: hill0
Date: 23 Jan 2023 06:41:57
Packaging and the Environment: Alternatives, Trends and Solutions

Packaging and the Environment: Alternatives, Trends and Solutions
English | 2022 | ISBN: 1566761042 | 261 Pages | PDF (True) | 38 MB
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Force Sensors for Microelectronic Packaging Applications

Posted By: Jeembo
Date: 6 Jan 2023 12:12:17
Force Sensors for Microelectronic Packaging Applications

Force Sensors for Microelectronic Packaging Applications by Jürg Schwizer, Michael Mayer, Oliver Brand
English | 2005 | ISBN: 3540221875 | 178 Pages | PDF | 16.8 MB

Intended for wire-bonding and flip-chip packaging professionals and for scientists and engineers working in the field of mechanical microsensors, this practical monograph introduces novel measurement technologies that allow for in situ and real-time examination of physical processes during the packaging process or during subsequent reliability tests.
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Interactive Packaging Design

Posted By: IrGens
Date: 27 Nov 2022 11:43:26
Interactive Packaging Design

Interactive Packaging Design by Chong Peng
English | September 1, 2018 | ISBN: 1912268531 | True EPUB | 248 pages | 9.2 MB
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Packaging Materials and Processing for Food, Pharmaceuticals and Cosmetics

Posted By: AvaxGenius
Date: 13 Oct 2022 03:17:13
Packaging Materials and Processing for Food, Pharmaceuticals and Cosmetics

Packaging Materials and Processing for Food, Pharmaceuticals and Cosmetics Coordinated by Frédéric Debeaufort, Kata Galić, Mia Kurek, Nasreddine Benbettaieb, Mario Ščetar
English | PDF(True) | 2021 | 381 Pages | ISBN : 178945039X | 22.99 MB

This book provides valuable information on a range of food packaging topics. It serves as a source for students, professionals and packaging engineers who need to know more about the characteristics, applications and consequences of different packaging materials in food-packaging interactions.
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